In the MA780 Datasheet, it defines a PCB component footprint with an under chip body thermal pad, but then recommends that the IC NOT be soldered to the pad for best performance. To avoid possible confusion by 3rd party assembly shops who may think we forgot to include a paste aperture and soldier it anyway, is it OK to remove the pad from the footprint? Covering it over with soldermask seems like it might affect the seating of the part on the other pads.
Hello mfugere,
Yes, you can remove the pad from the footprint.
Best,
Carmine