Thermal performance of MP6615 is available in a TQFN-26 (6mmx6mm) package

Motor Drivers/Sensors
1

Is the lack of an exposed pad the reason for the relatively poor thermal performance of MP6615 in a TQFN-26 (6mmx6mm) package, compared with NXPs MC33HB200x thermal resistance of <1.0 °C/W between junction and
case (exposed pad). What can be done to improve heat rejection?

2

Hello Rich,

The MP6615 has a JA of 21.4 C/W while the MC33HB2000 has a JA of 21.55 or 31.3 C/W depending on the package.

Generally, you can improve the thermals by adding thermal vias to disperse heat more uniformly.
We also list some layout recommendations to optimize heat performance here.

Regards,
Jonathan Hidalgo