MPQ8633B Thermal parameter

DC-DC Power Converters
1

Hi,
Could you provide me the Theta_JC_bot (Junction to Case thermal resistance with heat flow through package bottom) for the MPQ8633GBLE in its QFN-21 (3*4mm) package.
This is a Jedec parameter (intrinsic device parameter) that is different from the Theta_JB given in the datasheet.
Thank you,
Fred.

2

Hi fautret,

Thanks for your question.
Yes, I am looking into this and will get back to you asap.

Thanks,
Cindy

3

Hi fautret,

Can you elaborate on the need for Theta JC_BOT? We don’t usually provide or have this value because Theta_JB measures the junction to board thermal resistance, which is the value that matters once the part is soldered onto the PCB.

Thanks,
Cindy

4

Hi Cindy,
This JEDEC parameter is required for elaborating the thermal model of the device in our thermal simulation tool.
Best regards,
Frederic

5

Hi Frederic,

In that case, theta-JB might suffice, but let me confirm with our PL team.

Cindy

6

Hi Frederic,

PL was able to provide θjc_bot = 2.5℃/W.

Thanks,
Cindy

7

Hi Cindy,
Thank you for your support.
Best regards,
Fred.