Please provide the thermal resistance detail for the below mentioned part
Part No:- MPM3683GQN-7
Required Detail: Junction-to-board resistance (θJB)
In the datasheet you can find θJA and θJC.
It doesn’t appear that θJB is characterized or published for this part, so it can’t be determined from the available parameters alone. This spec varies depending on board material, layer configuration, etc. Published values are typically characterized on a standardized JEDEC test board, so the actual effective θJB may differ in the end application.
Let me know if you have additional questions!