I’m designing a product using MP1541GG (QFN-8). Unfortunately, datasheet doesn’t provide any information about the exposed pad.
- My question is, should the exposed pad be connected to ground (GND) or only soldered to the PCB for thermal power dissipation?
I also couldn’t find any reference design or layout examples for this particular MP1541GG package variant (QFN-8).
- If possible, could you provide any information regarding layout for this MP1541GG package variant?
Best regards