When cleaning MPM3520EGLD & MPM3550EGLE after reflow soldering with the widely used PCB cleaner Vigon A201, the cleaner enters the component through the small hole in the housing. Unfortunately, during the subsequent rinsing process with deionized water, very little rinse water enters the component. This results in a high concentration of cleaner inside the component, including dissolved flux residues. Although moisture is removed during the subsequent vacuum drying step, the reactive chemical residues remain inside the housing. This has resulted in failures due to corrosion.
Can the small hole in the housing be permanently sealed AFTER the reflow process so that no cleaner enters the component?