Hi,
The MP3429 is a QFN-13 (3mmx4mm) package. There is a recommended land pattern on the last page of the datasheet.
We seem to be having problems reliably reflowing this part. Previously, we had problems with the 10 smaller pins bridging. We reduced the aperture size by 1 mil. There were 15 prototypes in the last run and now three of those had issues with not enough solder on the pins.
Is there a recommended solder paste application for this component?
Matt M.
I’m sorry for not being clear. The question was about the openings (apertures) in the metal stencil for the solder paste. We are having problems with bridging (too much solder) across the pins and not having enough solder on the pins when the apertures were changed.
Matt Meerian