Hello! I’m using the provided Kicad library for the MP2672 and have a question about the solder stencil/paste mask. The paste mask has two large square boxes that overlap all the pins for the upper and lower half of the IC. The solder mask has no opening for a thermal land under the chip so there’s no obvious place or purpose for all that extra solder and I’m worried it will short all the pins. Is this correct or should the solder mask/stencil only expose the pin pads? Thanks!
Hi lt.thieman,
Thank you for contacting the MPS Forum. I would say that our library files for all of our devices are correct in the sense that we use them for our own evaluation boards. I would simply follow the recommendations you see from the layout sections of the datasheet and evaluation board to the best of your abilities. If you want the Altium files for the layout, we can actually send this to you as well. If this is something you are interested in, please send a note to MPS Now at mpsnow@monolithicpower.com.
Thanks,
Brendan Schoemehl
Field Applications Engineer
Monolithic Power Systems | MPS Now